Contact Image Sensor and CIS Modules

A standard CIS module is an optical device which consists of sensor board, SELFOC Lens Array (SLA), light source within a housing sealed by cover glass. The sensor board is carefully designed with in-house linear sensor chips using silicon butting technology. One chip can be butted to another chip to form a long sensor module, the end pulse of the preceding chip is connected to the start pulse of the next chip. The length of the module can be extended from one chip up to A0 size. The key advantages to CIS modules include compact size, cost effectiveness, low power consumption, non-distorted precise image reading, easy implementation and flexible design.