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Chip on board foundry

Chip on Board Services

CMOS Sensor Inc offers full COB module services including:

  • Chip-on-Board circuit

    • ​Development

    • Design 

    • Manufacturing 

    • Assembly

    • And testing one-stop service

  • FR4, FR5, a variety of substrate options such as flexible ceramic substrates.

  • Chip on board modules designed exclusively for imaging, power supply, and RF module manufacturing technology.

  • Small batch orders from customers are acceptable as well.

  • COB and SMD components can coexist

  • Accepting COB component aspect ratio less than 1/25

chip on board one-stop service

One-Stop Chip-on-Board Module Services

chip on board illuminated by light

COB Capabilities:

  • Capable of handling six different dice

  • High Die Bond Accuracy: < 50 µm

  • Bond Height Differential: 0.9mm

  • Line Quantity/ Program: 3000 Max

  • Wire Diameter: 0.7mil ~ 1.3 mil

  • Loop Shape Options: 11Max

  • Bond Placement Error: 1st →3.5µm, 2nd →12.5µm

  • Ball Size:1.4~3 wire diameter, repeatability →0.2mil

COB module packaging design and development service
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