Designing and manufacturing high quality electro-optical image acquisition solutions since 1997.

CMOS Sensor Inc. is a Silicon Valley semi-conductor company that designs and manufactures high quality electro-optical image acquisition solutions.

Founded by Dr. Bill Wang, CMOS Sensor Inc. products are found in a wide variety of applications from basic research to lunar mineral mapping, industrial quality assurance, commercial imaging, medical and consumer imaging markets.

With headquarters in Silicon Valley California, CMOS Sensor Inc is aligned with subsidiaries in Ahmedabad, India and Taoyuan, Taiwan.  Our manufacturing joint venture in Shenzhen, China produces custom sensor products to our stringent quality standards.

2012 Wafer-scale cluster image sensor chip and method with replicated gap-less pixel line and signal readout circuit segments 

2012 Wafer-scale linear image sensor chip and method with replicated gap-less pixel line and signal readout circuit segments 

2011 Long-length industry camera image sensor for flat surface inspection application 

2010 A real active pixel image sensor with programmable row-specific gain for hyper-spectral imaging 

2009 Multiple light guide electronic document imaging device 

2003 Image sensor chip with an integrated operational amplifier and its application in a CIS module 

2001 Illumination device for use in image reading applications 

2000 Long depth of focus contact image sensor module for compact and light weight flatbed type scanning system 


2012 Wafer-scale cluster image sensor chip and method with replicated gapless pixel line and signal readout circuit segments 

A multi-pixel row wafer-scale cluster image sensor chip (WCISC) is proposed. Expressed in X-Y-Z coordinates with its pixel rows along X-axis, the WCISC converts areal image frame (IMFM) into areal image frame signal (AIFS). The WCISC includes multiple imaging pixel rows PXRW.sub.1, . . . , PXRW.sub.M. Each PXRW.sub.i has photoelectrical sensing elements spanning pixel row width PRW.sub.i and producing a pixel row image signal PRIS.sub.i. Each PXRW.sub.i is offset from PXRW.sub.1 by distance XOFST.sub.i and spaced from PXRW.sub.i-1 by distance SP.sub.i-1,I such that X- and Y-extremities of (PXRW.sub.1, . . . , PXRW.sub.M) define IMFM. The WCISC is so configured that any image pixel sweeping through IMFM will be sensed by at least one imaging pixel row. In the presence of Y-directional relative motion between WCISC and IMFM and an external electronic imaging controller (EEIC) interfacing with the WCISC, the EEIC can extract all PRIS.sub.i from WCISC and reconstruct the AIFS.

2012 Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments 

A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length L.sub.PL into line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLS.sub.j) of sensing elements. The LPLS.sub.j converts portion of the PLI into a raw image segment signal set (RISS.sub.j). The LPLS.sub.j set forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCS.sub.j) coupled to LPLS.sub.j for processing RISS.sub.j into a readout image segment signal set (ROSS.sub.j). The RCS.sub.j has a set of contact pads (CTP.sub.j) for off-chip interconnection. Upon off-chip interconnection of the CTP.sub.j set thus composing the ROSS.sub.j set into LIS, the WLISC functions as a key part of a linear image sensor system of image length L.sub.PL.

2011 Long-length industry camera image sensor for flat surface inspection application 

A long-length industry camera image sensor (LICIS) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length L.sub.PL along X-direction into a line image signal (LIS). The LICIS includes a full-width linear image sensor (FLIS) of length L.sub.IS along X-direction and displaced from the PLI along Z-direction by an imaging distance D.sub.IMG for converting an incident line image (ILI) impinging upon its FLIS top surface into the LIS. Where L.sub.IS is about equal to L.sub.PL. The LICIS also has a full-width linear rod lens (FLRL) of length L.sub.RL along X-direction and displaced from the PLI in Z-direction by a working distance D.sub.WKG. Where L.sub.RL is about equal to L.sub.PL and D.sub.WKG is selected such that the PLI gets focused by the FLRL into the ILI at the FLIS top surface with an imaging magnification factor of about 1:1.

2010 A real active pixel image sensor with programmable row-specific gain for hyper-spectral imaging 

An areal active pixel image sensor (AAPS) with programmable row-specific gain is disclosed for converting hyper-spectral light image into video output signal (VOS). The AAPS includes: a) An areal active pixel sensor (APS) array each capable of photoelectrically converting and integrating an incident pixel light into a photoelectric signal through an integration time period TNT with a photoelectric signal gain GPE. b) A video output signal conditioner (VOSC), coupled to the APS array, for multiplexing and amplifying the photoelectric signals into the VOS with an electric signal gain GEE. c) The VOSC further programmably sets at least one of GPE and GEE to be row-specific. Consequently, the AAPS exhibits an overall photoelectric signal gain of GOA=GPE.times.GEE that is row-specific and it can compensate for image signal distortion caused by non-uniform spectral response of the APS elements during hyper-spectral imaging.

2009 Multiple light guide electronic document imaging device

A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.

2003 Image sensor chip with an integrated operational amplifier and its application in a CIS module 

A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.

2001 Illumination device for use in image reading applications 

This invention discloses an illumination device for use in image reading applications. The illumination device comprises a light guide and a light source attached to one end of the light guide, which consists of a rod-shaped body with two end light reflectors made of metal clips. The two lateral surfaces of the light guide causes total internal reflection of light rays impinging upon the surface from within the light guide. The curved top surface of the light guide serves the function of focusing. The narrow bottom surface along the light guide reflects the light with a series of highly reflective paint stripes of varying widths applied upon it. The light source comprises a plurality of light emitting elements and at least a center of the light emitting elements is placed along a normal line passing through a center of the reflection area when viewed in a longitudinal direction of the light guide. A light beam applied from the light source is scattered and reflected by a scatter and reflection area of the light guide to illuminate an original document.

2000 Long depth of focus contact image sensor module for compact and light weight flatbed type scanning system 

An image sensor system having very long Depth Of Focus (DOF) on the document plane and very short optical distance from the document plane to the image plane provides the advantages of both a lens reduction image sensor system and a contact type image sensor system. The inventive image sensor system thus provides a Long depth of Focus Contact type Image Sensor (Lf-cis) system that can be assembled in a compact and light weight module that is suitable for use in current image scanning systems (for example, flatbed type, paper feeder type, and handheld type). The invention also provides a compact and light weight flatbed type image scanning system. The CIS module may be modified such that two ends of the module higher than the rest of the module, a steel bracket holds the module and maintains the optical path in alignment, and a metal carriage having metal spring holds the module. The CIS module is self aligned to the bottom of the scanner glass. No optical adjustment or mechanical adjustment is required on the scanner assembly line. A central guideway and a low power stepping motor are provided to drive the entire module.